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Hong Kong presents great opportunities for new technologies 3D printing and wearable software, say experts at Asia's largest Spring electronics fair and concurrent HKTDC International ICT Expo 2014. The giant chipmaker Intel takes a booth for the first time and holds a key seminar on China's ecosystem, recognising what it says is the dynamism present at the HKTDC Hong Kong Electronics Fair Spring Edition 2014.

Speakers:
John Zhang, Associate Professor, Hong Kong Polytechnic University
Nicolas Olivier, CEO, CONNECTEDEVICE Ltd
Glenn Quiro, Vice General Manager, Intel China R&D

Related Links:
Hong Kong Electronics Fair (Spring Edition):
Hong Kong In'tlICT Expo:
Intel China:
Hong Kong Polytechnic University:
CONNECTEDEVICE:
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